3D IC Stacking Technology

3D IC Stacking Technology

Editorial: McGraw-Hill Digital

Sello: McGraw-Hill Digital

Colección:  

DRM: Si

Formato: EPUB

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology

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3D IC Stacking Technology

Editorial
McGraw-Hill Digital
Materias
Matemáticas Y Ciencia | Ciencia: Cuestiones Generales | Tecnología, Ingeniería, Agricultura | Normas Científicas | Medidas Y Sistemas De Medición
Idioma
Inglés
F. Publicación
ISBN
9780071741958
DRM
Si
Páginas
374
Formato
EPUB
Colección
Tamaño
10873 Kbytes
Sello
McGraw-Hill Digital
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